Principal Engineer

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
• Leads new package and SMT/Flip Chip/Underfill process qualification programs.
• Develops and maintain process documentation, including standard operating procedures and work instructions.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem-solving tools.
• Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
• Acts as a liaison with suppliers/vendors.
• Maintains product quality while developing and introducing package cost reduction programs.
• Coordinates and leads the introduction of new package processes into production.
• Collaborate with cross-functional teams to lead FC team to drive continuous improvement projects.
• Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation solutions.
  
  

Qualifications

REQUIRED:

• Bachelor/Master/PhD engineering/material/science required plus min 8 years of relevant work experience, min 5 year for PhD.
• Relevant work experience must be in engineering role within semiconductor industry.
• Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.